[size=6.5pt]DIM imension



[size=6.5pt]尺寸



[size=6.5pt]
LCL:Lower control limit



[size=6.5pt]管制下限



[size=6.5pt]
UCL:Upper control limit



[size=6.5pt]管制上限



[size=6.5pt]
EMI:



[size=6.5pt]電磁干擾



[size=6.5pt]
ESD:



[size=6.5pt]靜電防護



[size=6.5pt]
EPA:



[size=6.5pt]靜電保護區域



[size=6.5pt]
ECN:



[size=6.5pt]工程變更



[size=6.5pt]
ECO:Engineering change order



[size=6.5pt]工程改動(dòng)要求（客戶(hù)）



[size=6.5pt]
ECR:



[size=6.5pt]工程變更需求單



[size=6.5pt]
CPI:Continuous Process Improvement



[size=6.5pt]連續工序改善



[size=6.5pt]
Compatibility



[size=6.5pt]：兼容性



[size=6.5pt]
Marking



[size=6.5pt]：標記



[size=6.5pt]
DWG rawing



[size=6.5pt]圖面



[size=6.5pt]
Standardization



[size=6.5pt]：標準化



[size=6.5pt]
Consensus



[size=6.5pt]：一致



[size=6.5pt]
Code



[size=6.5pt]：代碼



[size=6.5pt]
ZD:Zero defect



[size=6.5pt]零缺點(diǎn)



[size=6.5pt]
Tolerance



[size=6.5pt]：公差



[size=6.5pt]
Subject matter



[size=6.5pt]：主要事項



[size=6.5pt]
Auditor



[size=6.5pt]：審核員



[size=6.5pt]
BOM:Bill of material



[size=6.5pt]物料清單



[size=6.5pt]
Rework



[size=6.5pt]：重工



[size=6.5pt]
ID



[size=6.5pt]：



[size=6.5pt]identification



[size=6.5pt]識別



[size=6.5pt],



[size=6.5pt]鑒別



[size=6.5pt],



[size=6.5pt]證明



[size=6.5pt]
PILOT RUN: (



[size=6.5pt]試投產(chǎn)



[size=6.5pt])



[size=6.5pt]
FAI:



[size=6.5pt]首件檢查



[size=6.5pt]
FPIR



[size=6.5pt]：



[size=6.5pt]First Piece Inspection Report



[size=6.5pt]首件檢查報告



[size=6.5pt]
FAA:



[size=6.5pt]首件確認



[size=6.5pt]
SPC



[size=6.5pt]：統計制程管制



[size=6.5pt]
CP: capability index



[size=6.5pt]（準確度）



[size=6.5pt]
CPK: capability index of process(



[size=6.5pt]制程能力



[size=6.5pt])



[size=6.5pt]
PMP:



[size=6.5pt]制程管理計劃（生產(chǎn)管制計劃）



[size=6.5pt]
MPI:



[size=6.5pt]制程分析



[size=6.5pt]
DAS efects Analysis System 



[size=6.5pt]缺陷分析系統



[size=6.5pt]
PPB



[size=6.5pt]：十億分之一



[size=6.5pt]
Flux



[size=6.5pt]：助焊劑



[size=6.5pt]
P/N:



[size=6.5pt]料號



[size=6.5pt]
L/N



[size=6.5pt]：



[size=6.5pt]Lot Number



[size=6.5pt]批號



[size=6.5pt]
Version



[size=6.5pt]：版本



[size=6.5pt]
Quantity



[size=6.5pt]：數量



[size=6.5pt]
Valid date



[size=6.5pt]：有效日期



[size=6.5pt]
MIL-STD



[size=6.5pt]：



[size=6.5pt]Military-Standard



[size=6.5pt]軍用標準



[size=6.5pt]
ICT: In Circuit Test (



[size=6.5pt]線(xiàn)路測試



[size=6.5pt])



[size=6.5pt]
ATE



[size=6.5pt]：



[size=6.5pt]Automatic Test Equipment



[size=6.5pt]自動(dòng)測試設備



[size=6.5pt]
MO: Manafacture Order



[size=6.5pt]生產(chǎn)單



[size=6.5pt]
T/U: Touch Up (



[size=6.5pt]錫面修補



[size=6.5pt])



[size=6.5pt]
I/N:



[size=6.5pt]手插件



[size=6.5pt]
P/T:



[size=6.5pt]初測



[size=6.5pt]
F/T: Function Test (



[size=6.5pt]功能測試



[size=6.5pt]-



[size=6.5pt]終測



[size=6.5pt])



[size=6.5pt]
AS



[size=6.5pt]組立



[size=6.5pt]
P/K:



[size=6.5pt]包裝



[size=6.5pt]
TQM:Totalquality control





[size=6.5pt]全面品質(zhì)管理



[size=6.5pt]
MDA:manufacturing defect analysis



[size=6.5pt]制程不良分析



[size=6.5pt](ICT)



[size=6.5pt]
RUN-IN:



[size=6.5pt]老化實(shí)驗



[size=6.5pt]
HI-pot



[size=6.5pt]：高壓測試



[size=6.5pt]
FMI



[size=6.5pt]：



[size=6.5pt]Frequency Modulation Inspect



[size=6.5pt]高頻測試



[size=6.5pt]
DPPM: Defect Part Per Million


(



[size=6.5pt]不良率的一種表達方式：百萬(wàn)分之一



[size=6.5pt]) 1000PPM



[size=6.5pt]即為



[size=6.5pt]0.1%



[size=6.5pt]
Corrective Action: (CAR



[size=6.5pt]改善對策



[size=6.5pt])



[size=6.5pt]
ACC



[size=6.5pt]：允收



[size=6.5pt]
REJ:



[size=6.5pt]拒收



[size=6.5pt]
S/S



[size=6.5pt]：



[size=6.5pt]Sample size



[size=6.5pt]抽樣檢驗樣本大小



[size=6.5pt]
SI-SIV



[size=6.5pt]：



[size=6.5pt]Special I-Special IV



[size=6.5pt]特殊抽樣水平等級



[size=6.5pt]
CON



[size=6.5pt]：



[size=6.5pt]Concession / Waive



[size=6.5pt]特采



[size=6.5pt]
ISO:



[size=6.5pt]國際標準化組織



[size=6.5pt]
ISA



[size=6.5pt]：



[size=6.5pt]Industry Standard Architecture



[size=6.5pt]工業(yè)標準體制結構



[size=6.5pt]
OBA:



[size=6.5pt]開(kāi)箱稽核



[size=6.5pt]
FIFO:



[size=6.5pt]先進(jìn)先出



[size=6.5pt]
PDCA:



[size=6.5pt]管理循環(huán)



[size=6.5pt]
Plan do check action



[size=6.5pt]計劃，執行，檢查，總結



[size=6.5pt](



[size=6.5pt]計劃，實(shí)施，檢查，處置



[size=6.5pt])



[size=6.5pt]
WIP:



[size=6.5pt]在制品（半成品）



[size=6.5pt]
S/O: Sales Order (



[size=6.5pt]業(yè)務(wù)訂單



[size=6.5pt])



[size=6.5pt]
P/O: Purchase Order (



[size=6.5pt]采購訂單



[size=6.5pt])



[size=6.5pt]
P/R: Purchase Request (



[size=6.5pt]請購單



[size=6.5pt])



[size=6.5pt]
AQL:acceptable quality level



[size=6.5pt]允收品質(zhì)水準



[size=6.5pt]
LQL;Limiting quality level



[size=6.5pt]最低品質(zhì)水準



[size=6.5pt]
QVL:qualified vendor list



[size=6.5pt]合格供應商名冊



[size=6.5pt]
AVL



[size=6.5pt]：認可的供貨商清單



[size=6.5pt](Approved Vendor List)



[size=6.5pt]
QCD: Quality cost delivery



[size=6.5pt]（品質(zhì)，交期，成本）



[size=6.5pt]
MPM:Manufacturing project management



[size=6.5pt]制造專(zhuān)案管理



[size=6.5pt]
KPI:Key performance indicate



[size=6.5pt]重要績(jì)效指標



[size=6.5pt]
MVT:Manufacturing Verification Test



[size=6.5pt]制造驗證試產(chǎn)



[size=6.5pt]
Q/R/S



[size=6.5pt]：



[size=6.5pt]Quality/Reliability/Service



[size=6.5pt]質(zhì)量



[size=6.5pt]/



[size=6.5pt]可靠度



[size=6.5pt]/



[size=6.5pt]服務(wù)



[size=6.5pt]
STL:ship to line



[size=6.5pt]（料到上線(xiàn)）



[size=6.5pt]
NTF:No trouble found



[size=6.5pt]誤判



[size=6.5pt]
CIP:capacity improvement plan



[size=6.5pt]（產(chǎn)能改善計劃）



[size=6.5pt]
MRB:material review board



[size=6.5pt]（物料審核小組）



[size=6.5pt]
MRB:Material reject bill



[size=6.5pt]退貨單



[size=6.5pt]
JIT:just in time



[size=6.5pt]（即時(shí)管理）



[size=6.5pt]
5S:seiri seiton seiso seiketsu shitsuke




[size=6.5pt]（整理，整頓，清掃，清潔，修養）




[size=6.5pt]SOP:standard operation process



[size=6.5pt]（標準作業(yè)程序）



[size=6.5pt]
SIP:Specification inspection process



[size=6.5pt]制程檢驗規格



[size=6.5pt]
TOP: Test Operation Process (



[size=6.5pt]測試作業(yè)流程



[size=6.5pt])



[size=6.5pt]
WI: working instruction



[size=6.5pt]（作業(yè)指導書(shū)）



[size=6.5pt]
SMD:surface mounting device



[size=6.5pt]（表面粘著(zhù)原件）



[size=6.5pt]
FAR:failure aualysis report



[size=6.5pt]故障分析報告



[size=6.5pt]
CAR:Corrective action report



[size=6.5pt]改善報告



[size=6.5pt]
BPR



[size=6.5pt]：






[size=6.5pt]企業(yè)流程再造



[size=6.5pt] (Business ProcessReengineering)



[size=6.5pt]
ISAR



[size=6.5pt]：首批樣品認可



[size=6.5pt](Initial Sample ApprovalRequest)-



[size=6.5pt]
JIT



[size=6.5pt]：實(shí)時(shí)管理



[size=6.5pt] (Just In Time)



[size=6.5pt]
QCC



[size=6.5pt]：品管圈



[size=6.5pt] (Quality Control Circle)



[size=6.5pt]
Engineering Department (



[size=6.5pt]工程部



[size=6.5pt])



[size=6.5pt]
TQEM: Total Quality Environment Management


(



[size=6.5pt]全面品質(zhì)環(huán)境管理



[size=6.5pt])



[size=6.5pt]
PD: Production Department (



[size=6.5pt]制造



[size=6.5pt])



[size=6.5pt]
LOG: Logistics (



[size=6.5pt]后勤支持



[size=6.5pt])



[size=6.5pt]
Shipping: (



[size=6.5pt]進(jìn)出口



[size=6.5pt])



[size=6.5pt]
AOQ



[size=6.5pt]：



[size=6.5pt]Average Output Quality



[size=6.5pt]平均出貨質(zhì)量



[size=6.5pt]
AOQL



[size=6.5pt]：



[size=6.5pt]Average Output Quality Level



[size=6.5pt]平均出貨質(zhì)量水平



[size=6.5pt]
FMEA



[size=6.5pt]：



[size=6.5pt]failure model effectiveness analysis



[size=6.5pt]失效模式分析



[size=6.5pt]
CRB: Change Review Board (



[size=6.5pt]工程變更會(huì )議



[size=6.5pt])



[size=6.5pt]
CSA



[size=6.5pt]：



[size=6.5pt]Customer Simulate Analysis



[size=6.5pt]客戶(hù)模擬分析



[size=6.5pt]
SQMS



[size=6.5pt]：



[size=6.5pt]Supplier Quality Management System



[size=6.5pt]供應商品質(zhì)管理系統



[size=6.5pt]
QIT: Quality Improvement Team



[size=6.5pt]品質(zhì)改善小組



[size=6.5pt]
QIP



[size=6.5pt]：



[size=6.5pt]Quality Improvement Plan



[size=6.5pt]品質(zhì)改善計劃



[size=6.5pt]
CIP



[size=6.5pt]：



[size=6.5pt]Continual Improvement Plan



[size=6.5pt]持續改善計劃



[size=6.5pt]
M.Q.F.S: Material Quality Feedback Sheet (



[size=6.5pt]來(lái)料品質(zhì)回饋單



[size=6.5pt])



[size=6.5pt]
SCAR: Supplier Corrective Action Report (



[size=6.5pt]供貨商改善對策報告



[size=6.5pt])



[size=6.5pt]
8D Sheet: 8 Disciplines sheet ( 8D



[size=6.5pt]單



[size=6.5pt])





[size=7.0pt]小組成立


[size=7.0pt]問(wèn)題說(shuō)明


[size=7.0pt]實(shí)施并驗證臨時(shí)措施


[size=7.0pt]確定并驗證根本原因

[size=7.0pt]



[size=7.0pt]選擇并驗證永久糾正措施


[size=7.0pt]實(shí)施永久糾正措施


[size=7.0pt]預防再發(fā)生


[size=7.0pt]小組祝賀


[size=6.5pt]PDCA



[size=6.5pt]：

[size=6.5pt]PDCA (Plan-Do-Check-Action) (



[size=6.5pt]管理循環(huán)

[size=6.5pt])



[size=6.5pt]
MPQ: Material Packing Quantity (



[size=6.5pt]物料最小包裝量

[size=6.5pt])



[size=6.5pt]
DSCN: Delivery Schedule Change Notice (



[size=6.5pt]交期變更通知

[size=6.5pt])



[size=6.5pt]
QAPS: Quality Assurance Process Sheet (



[size=6.5pt]品質(zhì)工程表

[size=6.5pt])



[size=6.5pt]
DRP



[size=6.5pt]：運銷(xiāo)資源計劃

[size=6.5pt] (DistributionResource Planning)



[size=6.5pt]
DSS



[size=6.5pt]：決策支持系統

[size=6.5pt] (Decision SupportSystem)



[size=6.5pt]
EC 



[size=6.5pt]：電子商務(wù)

[size=6.5pt] (ElectronicCommerce)



[size=6.5pt]
EDI



[size=6.5pt]：電子資料交換

[size=6.5pt] (Electronic DataInterchange)



[size=6.5pt]
EIS



[size=6.5pt]：主管決策系統

[size=6.5pt] (ExcutiveInformation System)




[size=6.5pt]ＥＲＰ




[size=6.5pt]：企業(yè)資源規劃

[size=6.5pt] (Enterprise ResourcePlanning)



[size=6.5pt]
FMS



[size=6.5pt]：彈性制造系統

[size=6.5pt] (FlexibleManufacture System)



[size=6.5pt]
KM 



[size=6.5pt]：知識管理

[size=6.5pt] (KnowledgeManagement)



[size=6.5pt]
4L



[size=6.5pt]：逐批訂購法

[size=6.5pt] (Lot-for-Lot)



[size=6.5pt]
LTC



[size=6.5pt]：最小總成本法

[size=6.5pt] (Least Total Cost)



[size=6.5pt]
LUC



[size=6.5pt]：最小單位成本

[size=6.5pt] (Least Unit Cost)



[size=6.5pt]
MES



[size=6.5pt]：制造執行系統

[size=6.5pt] (ManufacturingExecution System)



[size=6.5pt]
MPS



[size=6.5pt]：主生產(chǎn)排程

[size=6.5pt] (Master ProductionSchedule)



[size=6.5pt]
MRP



[size=6.5pt]：物料需求規劃

[size=6.5pt] (MaterialRequirement Planning)



[size=6.5pt]
MRP



[size=6.5pt]Ⅱ



[size=6.5pt]：制造資源計劃

[size=6.5pt] (ManufacturingResource Planning)



[size=6.5pt]
OEM



[size=6.5pt]：委托代工

[size=6.5pt] (Original EquipmentManufacture)



[size=6.5pt]
ODM



[size=6.5pt]：委托設計與制造

[size=6.5pt] (Original Design & Manufacture)



[size=6.5pt]
OLAP



[size=6.5pt]：線(xiàn)上分析處理

[size=6.5pt] (On-Line AnalyticalProcessing)



[size=6.5pt]
OLTP



[size=6.5pt]：線(xiàn)上交易處理

[size=6.5pt] (On-Line TransactionProcessing)



[size=6.5pt]
OPT



[size=6.5pt]：最佳生產(chǎn)技術(shù)

[size=6.5pt] (OptimizedProduction Technology)



[size=6.5pt]
PDCA



[size=6.5pt]：

[size=6.5pt]PDCA



[size=6.5pt]管理循環(huán)

[size=6.5pt] (Plan-Do-Check-Action)



[size=6.5pt]
PDM



[size=6.5pt]：產(chǎn)品數據管理系統

[size=6.5pt] (Product Data Management))



[size=6.5pt]
RCCP



[size=6.5pt]：粗略產(chǎn)能規劃

[size=6.5pt] (Rough Cut CapacityPlanning)



[size=6.5pt]
SCM



[size=6.5pt]：供應鏈管理

[size=6.5pt] (Supply ChainManagement)



[size=6.5pt]
SFC



[size=6.5pt]：現場(chǎng)控制

[size=6.5pt] (Shop Floor Control)



[size=6.5pt]
TOC



[size=6.5pt]：限制理論

[size=6.5pt] (Theory ofConstraints)




[size=6.5pt]TQC



[size=6.5pt]：全面品質(zhì)管制

[size=6.5pt] (Total Quality Control)



[size=6.5pt]
FYI/R:for your information/reference



[size=6.5pt]僅供參考



[size=6.5pt]
ASAP:



[size=6.5pt]盡快



[size=6.5pt]
S/T:Standard time



[size=6.5pt]標準時(shí)間



[size=6.5pt]
TPM:total production maintenance



[size=6.5pt]：全面生產(chǎn)保養



[size=6.5pt]
ESD Wrist strap



[size=6.5pt]：靜電環(huán)



[size=6.5pt]
IT:information technology



[size=6.5pt]信息技術(shù)，資訊科學(xué)



[size=6.5pt]
CEO



[size=6.5pt]：

[size=6.5pt]Chief ExecutiveOfficer



[size=6.5pt]執行總裁



[size=6.5pt]
COO



[size=6.5pt]：

[size=6.5pt]Chief OperaringOfficer



[size=6.5pt]首席業(yè)務(wù)總裁



[size=6.5pt]
SWOT



[size=6.5pt]：

[size=6.5pt]Strength,Weakness,Opportunity,Threat




[size=6.5pt]優(yōu)勢﹐弱點(diǎn)﹐機會(huì )﹐威脅



[size=6.5pt]
Competence



[size=6.5pt]：專(zhuān)業(yè)能力



[size=6.5pt]
Communication



[size=6.5pt]：有效溝通



[size=6.5pt]
Cooperation



[size=6.5pt]：統御融合



[size=6.5pt]
Vibration Testing



[size=6.5pt]：振動(dòng)測試



[size=6.5pt]
IDP



[size=6.5pt]：

[size=6.5pt]IndividualDevelopment Plan



[size=6.5pt]個(gè)人發(fā)展計劃



[size=6.5pt]
MRP



[size=6.5pt]：

[size=6.5pt]Material RequirementPlanning



[size=6.5pt]物料需求計劃



[size=6.5pt]
MAT'S



[size=6.5pt]：

[size=6.5pt]Material



[size=6.5pt]材料



[size=6.5pt]
LRR



[size=6.5pt]：

[size=6.5pt]Lot Rejeet Rate



[size=6.5pt]批退率



[size=6.5pt]
ATIN



[size=6.5pt]：

[size=6.5pt]Attention



[size=6.5pt]知會(huì )



[size=6.5pt]
3C



[size=6.5pt]：

[size=6.5pt]Computer,Communication , Consumer electronic




[size=6.5pt]消費性電子



[size=6.5pt]
5W1H



[size=6.5pt]：

[size=6.5pt]When , Where , Who ,What , Why , Ho



[size=6.5pt]
5M: Man , Machine , Material , Method , Measurement




[size=6.5pt]人

[size=6.5pt],



[size=6.5pt]機器

[size=6.5pt],



[size=6.5pt]材料

[size=6.5pt],



[size=6.5pt]方法

[size=6.5pt],



[size=6.5pt]測量